futureC integration software for on-wafer test futureC is a unified hardware communication and testing platform independently developed by Eoulu and it is also an operating system for on-wafer test and measurement futureC can easily integrate all the programmable devices.
futureC can help you for all this Upgraded version for EUCP Integrating all kinds of programmable testing equipment fast, and Mapping fast Platform is separated from application and instrument, modular maintenance by professional software team, reduce the dependence of the measurement on engineers High-precision and high-speed test What you measure is what you get, the original data and extraction parameters are automatically consolidated into a file, and it can be seamlessly uploaded to the futureD database. Integrating all kinds of programmable testing equipment fast, and Mapping fast Instrument change or application change, the test software does not need to be rewritten High-precision and high-speed test Strong customer base, rich library of measurement methods
Device communication Separation of device driver from test platforms, rich device driver library and modular driver development
MapEditor Users have a more intuitive experience based on the traditional wafer map editor User-defined SubDie map Accurately map the actual position of the DUT Wafer test system Support automatic and semiautomatic wafer test Support customizable location test Support rich test result color scale diagrams Offline classification of data Users can redefine binning conditions according to test data and wafer map Once binning condition is redefined, the data covers the original wafer map Multiple test modes Support selective retest Support continuous test of breakpoints Customize location for test Test alarm and alarm device reminder SECS/GEM protocol components Seamless connection to futureD (web big data management platform) SEMI E5-0600 (SECS-II) standard SEMI E30 (GEM) standard SEMI E37 (HSMS) standard Test result binning User-defined binning conditions Set the conditions for acceptance/rejection of test results Supports up to 4,096 bins and color gradient map Multiple measurement modes Single-point test and measurement Single-position repeated test and measurement on-wafer measurement and multi-chip measurement supported Graphical curve display of 2D curve, 3D curve, RF curve display and oscilloscope waveform Display test information and brief data statistics, such as test time and yield
Set the test menu Automatically list the integrated devices and application input and output parameters User-defined test process as measurement recipe Import/Export measurement recipe
What you measure is what you get File data formatting and saving User-defined test result output items and sequence Dragging function makes operation convenient and fast Rapid system integration Quickly start test Mapping and measurement control Factory automation futureC installation environment Typical speed values of futureC test system Operating environment No special environmental requirements. Note: futureC supports real-time data storage and continuous test of breakpoints to avoid unexpected loss of data. The test speed is related to the configuration and running status of the test PC. The operation resources for the following typical values are Win10 64bit, CPU I7-9, and 16G memory:
Appendix 1: Examples of Common Drivers
Appendix 2: Quick Selection of Test Application Drivers
|